Polyimide Design Application Technology - List of Manufacturers, Suppliers, Companies and Products

[Book] High-Performance Design and Application Technology of Polyimide (No. 2165BOD)

Technical Specialty Books - Low Dielectric Properties, Low Thermal Expansion, Transparency, Adhesion and Bonding Properties, Formability -

★ "5G Circuit Boards," "Flexible Organic EL," "Materials for LiB," "Onboard Drive Motors" Explaining the points of high functionality, performance improvement, and product application for new usage development! －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Document 【5G Related Components】 - Low dielectric loss polyimide for 5G and millimeter wave applications - Development of low dielectric polyimide adhesives for FPC - Direct metallization on polyimide films 【Flexible Displays】 - Development status and technological direction towards low CTE transparent polyimide - Transparent polyimide for foldable smartphones - Flexible LCD using polyimide film substrates 【Insulation Materials for EV/HEV】 - Polyimide coatings for onboard drive motors that balance high insulation and high heat resistance - Required characteristics and adhesion improvement for motor winding insulation coatings 【Lithium-Ion Batteries】 - Development status of polyimide binders for high-capacity silicon-based anodes - Development and challenges of polyimide separators for lithium metal batteries 【Aerospace and Space Fields】 - Development trends of heat-resistant CFRP using polyimide as the base material - Application of thermoplastic polyimide to prepregs

• Company：技術情報協会
• Price：10,000 yen-100,000 yen

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